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2.5 inches SSDs proposed by APLUS Système Automation, are manucfactured by our partner Innodisk. SLC, iSLC, MLC or 3D TLC technologies are available. This are suitable for military and industrial applications.
SSD innodisk
See the products range: www.innodisk.com
SLC – iSLC technologies |
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| See also: MLC – 3DTLC |
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| Model Name | 2.5″ SATA SSD 3SE | 2.5″ SATA SSD 3SE4 | 2.5″ SATA SSD 3IE3 | 2.5″ SATA SSD 3IE4 |
| Interface | SATA III 6Gb/s | SATA III 6Gb/s | SATA III 6Gb/s | SATA III 6Gb/s |
| Flash Type | SLC | SLC | iSLC | iSLC |
| Capacity | 4GB~256GB | 8GB~64GB | 8GB~256GB | 8GB~128GB |
| Max. Channels | 4 | 2 | 4 | 2 |
| Sequential R/W (MB/sec, max.) | 490/430 | 520/360 | 440/240 | 530/380 |
| Max. Power Consumption | 3.0 W (5V x 600 mA ) | 1.1 W (5V x 220 mA ) | 2.71 W (5V x 542 mA ) | 0.8 W (5V x 160 mA ) |
| Thermal Sensor | ST- Optional WT- Default | Y | ST- Optional WT- Default | Optional |
| External DRAM Buffer | N | N | N | N |
| iCell (power energy to flush the RAM buffer) | N | N | ||
| H/W Write Protect | N | N | N | N |
| AES Encryption | ||||
| ATA Security | Y | Y | Y | Y |
| S.M.A.R.T. | Y | Y | Y | Y |
| Dimension (WxLxH/mm) | 69.85 x 99.85 x 9.20 | 69.85 x 100.10 x 6.9 | 69.85 x 100.10 x 7.0 | 69.85 x 100.10 x 6.9 |
| Vibration | 20G@7~2000Hz | |||
| Shock | 1500G@0.5ms | |||
| MTBF | >3 million hours | |||
| Storage Temperature | -55°C ~ +95°C | |||
| Operation Temperature | 0°C ~ +70°C or -40°C ~ +85°C | |||
MLC – 3DTLC technologies |
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| See also: SLC – iSLC |
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| Model Name | 2.5″ SATA SSD 3MG2-P | 2.5″ SATA SSD 3MV2-P | 2.5” SATA SSD 3TS5-P | 2.5” SATA SSD 3TE7 | 2.5” InnoAGE SATA SSD 3TI7 |
| Interface | SATA III 6Gb/s | SATA III 6Gb/s | SATA III 6Gb/s | SATA III 6Gb/s | SATA III 6Gb/s |
| Flash Type | MLC | MLC | 3D TLC | 3D TLC | 3D TLC |
| Capacity | 8GB~2TB | 8GB~2TB | 256GB~1TB | 32GB~1TB | 64GB~1TB |
| Max. Channels | 4 | 4 | 4 | 4 | 4 |
| Sequential R/W (MB/sec, max.) | 520/480 | 520/450 (steady performance refer to TPS) | 560/490 | 560/330 | 560/330 |
| Max. Power Consumption | 6 W (5V x 1.2A ) | 5.78 W (5V x 1155 mA ) | 6.15 W (5V x 1230 mA ) | 3.6W | 3.6W |
| Thermal Sensor | Y | Y | Y | Y | Y |
| External DRAM Buffer | Y | Y | Y | ||
| iCell (power energy to flush the RAM buffer) | Optional | Y | Y | ||
| H/W Write Protect | N | Optional | Optional | ||
| AES Encryption | Y | ||||
| ATA Security | Y | Y | Y | Y | Y |
| S.M.A.R.T. | Y | Y | Y | Y | Y |
| Dimension (WxLxH/mm) | 69.85 x 100.0 x 6.9 mm (8GB-1TB) 69.85 x 100.0 x 9.5 mm (2TB) | 69.85 X 100.00 X 6.9 69.85 X 100.00 X 9.5 | 69.85 x 100.10 x 6.9 | 69.8 x 100.0 x 6.8 | 69.85 x 100.00 x 7.00 |
| Vibration | 20G@7~2000Hz | ||||
| Shock | 1500G@0.5ms | ||||
| MTBF | >3 million hours | ||||
| Storage Temperature | -55°C ~ +95°C | ||||
| Operation Temperature | 0°C ~ +70°C or -40°C ~ +85°C | 0°C ~ +70°C | 0°C ~ +70°C or -40°C ~ +85°C | ||
